How can data centres adapt when AI is driving rack densities beyond conventional limits?
As AI continues to demand rack power and thermal densities that exceed current designs, the pressure is on to adapt and adjust data centre infrastructure to accommodate this rapidly changing technology.
Tech Showcase at DCD Connect | India
Deerns’ Data Centre Unit Director, Spain, Andrei Pawlaczyk will explore this challenge when he takes to the stage at DCD Connect | India.
His session will examine how high-density AI deployments are reshaping the architecture of data centres through changing demands on both cooling and power – from direct-to-chip liquid cooling and CDU integration to emerging 800 VDC distribution.
Using practical design experience and an illustrative 50 MW example, Andrei will explore hydraulic topology, electrical distribution, spatial planning, resilience, PUE and heat-reuse opportunities.
Four key takeaways
- Understand how AI rack densities reshape facility infrastructure
- Integrate liquid cooling, hydraulics, electrical and spatial design from concept stage
- Assess the implications of emerging 800 VDC architectures for high-density AI
- Compare the energy impact of air, direct liquid and immersion cooling
You’re invited: DCD Connect | India 13-14 October 2026
🗣️ Andrei will present a Tech Showcase: Engineering high-density AI data centres
📍Spotlight stage, 14 October, 14:30-15:00
Or catch the team
📍 Booth 47, Fairmont, Mumbai
🤝 Connect with Andrei Pawlaczyk Aishwariya Das Ravindra Burse Dikshita Ghawalkar Daniela Arteaga Ainara Goritti Raul Peralta Andreu Robert
